H3C Custom Server

1. Core Processing System

• CPU Model: AMD EPYC 9554P (Zen4 Architecture)

• Cores/Threads: 64C/128T

• Base Clock: 3.1GHz, Max Boost: 3.75GHz

• L3 Cache: 256MB

• TDP: 360W

• PCIe 5.0 support for exceptional I/O performance

• Optimized for datacenter workloads: virtualization, cloud computing, big data analytics

2. Memory System

• Configuration: 32GB DDR4 ECC RDIMM × 2 (Total 64GB)

• Memory Type: 3200MHz ECC Registered DIMM

• Max Expandability: Up to 1TB supported

• 8-channel architecture (204.8GB/s bandwidth)

• ECC error correction for data integrity

3. Storage Solution

• Primary Storage: Intel NVMe SSD 8TB

• Likely Model: Intel SSD D7-P5600 Enterprise

• Read: Up to 7000MB/s

• Write: Up to 4200MB/s

• Random Read: Up to 1M IOPS

• Endurance: 1DWPD

• 3D NAND technology for reliability

• Storage Expansion:

• Each supports 4 devices

• Total 12 additional devices possible

• 8 SAS/SATA ports

• Hardware RAID 0/1/10

• Low-power design (~10W)

• HBA: LSI 9217-8i 6Gb/s SAS Controller

• SAS Cables: SFF8087-SFF8087 ×3

4. Motherboard & System Architecture

• Model: Supermicro X11SCD-F

• 8× SATA3 6Gb/s

• 2× M.2 NVMe

• 3× PCIe 5.0 x16

• 2× PCIe 4.0 x8

• Form Factor: E-ATX (305×267mm)

• Chipset: AMD SP5 Platform

• Expansion:

• Storage:

• Networking: 2× 1GbE (Intel I350-AM2)

5. Graphics & Acceleration

• GPU: NVIDIA GeForce RTX 4070

• CUDA

• Tensor Cores (AI)

• RT Cores (Ray Tracing)

• CUDA Cores: 5888

• VRAM: 12GB GDDR6X

• Bandwidth: 504GB/s

• TDP: 200W

• Features:

• Use Cases: Deep learning, video transcoding, 3D rendering

6. Power & Cooling

• PSU: GreatWall 2400W

• 80Plus Platinum (≥92% efficiency)

• Single +12V rail (200A)

• Full modular

• Hot-swap capable

• Protections: OVP/OCP/OPP/SCP

• Cooling:

• CPU: 4U active cooler

• System: 6× 80mm hot-swap fans

• Control: PWM via IPMI

7. Remote Management & Networking

• Management: IPMI 2.0

• KVM-over-IP

• Virtual media

• Hardware monitoring

• Dedicated 1GbE port

• Networking:

• RDMA (RoCEv2) support

• Low-latency

• Main: Intel X550/X710 10GbE

• Backup: 2× 1GbE (Intel I350)

8. Physical Specifications

• Chassis: 4U Rackmount

• Dimensions: 482×177×700mm (W×H×D)

• Weight: ~30kg (fully loaded)

• Drive Bays: 12× 3.5" hot-swap

• Expansion: 6× FHFL slots

• Environment:

• Operating Temp: 10°C-35°C

• Storage Temp: -40°C-60°C

• Humidity: 8%-90% non-condensing

• Altitude: Up to 3000m

9. Recommended Use Cases

1. Enterprise storage solutions

2. Virtualization platforms

3. AI training/inference

4. Video processing/rendering

5. Data analytics/databases

6. HPC cluster nodes